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Everyone's watching China's EUV prototype — but the more immediate story is DUV. A Chinese company has begun manufacturing an immersion deep-ultraviolet (DUV) lithography machine, the workhorse tool that produces the vast majority of the world's chips.
Unlike the EUV prototype (still in testing), the DUV machine is heading toward actual production:
Production is limited initially, but this is real hardware going to real fabs — a different category from a lab prototype.
EUV is essential for the bleeding edge (leading-edge logic below ~7nm), but DUV — especially immersion DUV — covers an enormous range of commercially critical chips: power management, memory, automotive, industrial, and older-node logic that runs the actual economy.
For China, a domestic DUV tool means reducing dependence on ASML for the chips it makes in the highest volume. Even with multi-patterning tricks, DUV can reach fairly advanced nodes — so this isn't just about legacy silicon.
The reality check: analysts note China's DUV still lags ASML by roughly four generations. Closing that gap is the multi-year project. But domestic supply, even behind the frontier, is strategic insurance.
Taken together — a DUV machine shipping and an EUV prototype testing — 2026 marks the point where China's domestic lithography stops being theoretical. It's the beginning of a parallel, self-contained supply chain that some call the "Silicon Curtain."
The DUV machine is the part of China's chip story that's happening now, not in 2030. It won't beat ASML this decade, but it changes who depends on whom.
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